BGA Assembly

Foundation Technology is superbly equipped for the manufacture of extremely advanced electronic surface mount printed circuit boards.

Every production line has the ability to place 0402 chips up to 56mm quads. Additionally, every production line has the ability to achieve 12 thou accuracy through full vision placement systems.

Once placed and processed, BGA placement can be analysed and tested.

Foundation Technology can offer:

• Agilent SJ50 Automatic optical inspection system to confirm chip alignment as well as joint inspection, presence and absence analysis and polarity checks.
• Xtek X-ray system allowing inspection of BGA Solder joints through the board itself.
• ERSA Scope facility allowing a cross-sectional, non-destructive visual image of hidden solder joints with images from practically any angle, and with enormous magnification range.