Technology capabilities

"A Total Solution"

With extensive and ongoing capital investments, Foundation Technology boasts one of the most sophisticated and advanced batch-build manufacturing capabilities in the UK.

Whether your requirements include advanced component packaging technology, such as chip scale packaging and micro-BGA, or advanced multi-layer circuit board technology, we have the experience, expertise and capital equipment to provide a total and high quality solution.

The capabilities offered by Foundation Technology include:

• 0201 to 56mm Square placement full vision control
• Screen printing down to 12 thou pitch technology
• Double sided high technology surface mount
• Double sided BGA
• PCB material FR4, polyimide, flexi-rigid, composite RF materials PCB's up to 24 layer 3.5mm laminate
• Technologies, industrial, military, avionics, automotive, communications, high end commercial video and sound
• Full supporting test, including AOI, Flying Probe, ICT, X-Ray and function test to customers own specifications and equipment
• Device replacement utilising SRT 1100 thermally controlled equipment
• RoHS and Non-RoHS manufacturing
• Aqueous and Co-solvent cleaning systems
• Through hole, press-fit, Intrusive reflow
• Dual-Wave solder machines